FIELD: thermal tests.
SUBSTANCE: in the method examined object is brought in thermal contact with reference object in the plane, where local heater is placed, constant power is supplied continuously to the heater, differences of temperatures m are measured by differential thermocouples, the hot soldered joint of one of them is located in the centre of heater, and the hot soldered joints of the others - at different distances from the heater centre. At every step of measurement value of dynamic parameter is monitored, heater is switched off whenever monitored dynamic parameter exceed preset value and required thermal properties are determined.
EFFECT: increase of required thermal properties determination accuracy.
2 dwg, 2 tbl
