FILM MANUFACTURING METHOD Russian patent published in 2009 - IPC H01L51/40 

Abstract RU 2346359 C2

FIELD: physics; semiconductors.

SUBSTANCE: invention relates to film with at least one electrical structural member and to method of manufacturing thereof. The method implies application of laser-cured adhesive compound onto a substrate film according to a specific pattern and/or irradiation according to a specific pattern so as to crystallise the adhesive according to a specific pattern. Onto adhesive, a decal film, which consists of substrate and electrical structural member, is applied. Substrate film is separated from the film body, which consists of base film, adhesive layer and electrical functional layer, so that in the first patterned area the electrical functional layer stays on the base film, and in the second patterned area the electric functional layer stays on the substrate and is separated from the base film together with the substrate.

EFFECT: enhanced method for manufacturing structural members using organic semiconductor technology.

30 cl, 5 dwg

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RU 2 346 359 C2

Authors

Vil'D Khajnrikh

Brem Ljudvig

Khanzen Akhim

Dates

2009-02-10Published

2004-10-19Filed