POLYAMIDE RESIN AND ARTICULATED MOULDED OBJECTS Russian patent published in 2009 - IPC C08G69/26 C08L77/00 C08K7/02 D01F6/80 B65D63/10 C12P13/00 C12N15/00 

Abstract RU 2347790 C2

FIELD: chemistry.

SUBSTANCE: present invention pertains to versions of polyamide resin in form of granules, to composition of polyamide resin, moulded objects, versions of articulated moulded objects, binding band, and unit thread. In the first version, polyamide resin contains components of dicarboxylic acid o links, containing adipinic acid links, and components of diamine links, containing pentamethylenediamine links and hexamethylenediamine links. Mass ratio the number of pentamethylenediamine links to the number of hexamethylenediamine links lies between 95:5 and 5:95. Pentamethylenediamine links are formed from pentamethylenediamine, obtained from lysine using lysine decarboxylase, capable of producing lysine decarboxylase cells, or a product of converting such cells. In the second version, polyamide resin contains components of diamine links, with mass ratio of the number of pentamethylenediamine links to the number of hexamethylenediamine links lying between 95:5 and 60:40. The polyamide resin composition essentially consists of the above mentioned polyamide resin and inorganic filling material. Content of inorganic filling material ranges from 0.01 to 150 mass units, per 100 mass units of polyamide resin. From polyamide resin or composition of polyamide resin, a moulded object is obtained using vibration welding, or an articulated object, or a binding band, or a unit thread. The articulated moulded object can also be made from polyamide resin, consisting of adipinic acid links and pentamethylenediamine links.

EFFECT: obtaining a polyamide resin with high thermal stability, a moulded object, with high vibration welding strength, an articulated moulded object and a binding bans, with good low-temperature strength, a unit thread, with good transparency.

20 cl, 6 tbl, 6 ex, 8 dwg

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RU 2 347 790 C2

Authors

Mijamoto Masaaki

Khitomi Tatsuja

Nisida Juuiti

Dates

2009-02-27Published

2005-05-19Filed