FIELD: technological processes.
SUBSTANCE: present invention is related to method for film application onto substrate, for instance paper substrate or similar substrate used for securities. Method for application of film on substrate comprises the following stages. Adhesive material is applied on substrate. Window is cut in substrate and in applied adhesive material. Layer of material is applied at least above cut window, at that layer of material does not bear adhesive material in area installed above window. Adhesive material is activated.
EFFECT: exclusion of possibility of machines contamination with adhesive material, and also accurate application of film onto substrate with window.
11 cl, 5 dwg
Authors
Dates
2009-06-10—Published
2005-01-05—Filed