FIELD: electronics.
SUBSTANCE: invention relates radio engineering and may be used for normalising temperature in modern computer processors. The device is based on processor cooling system including thermal module, radiator and fan and capacity control system for thermal module, which is comprised of a processor, digital-to-analog converter (DAC) and current source. So the thermal module is in conductive thermal contact with processor and radiator by means of electric insulation plates.
EFFECT: improved reliability and effectiveness of computer operation due to optimal thermal mode of computer operation.
2 dwg
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