METHOD OF RESISTANCE SOLDERING OF ELECTRICAL CONTACTS WITH HOLDERS Russian patent published in 2010 - IPC B23K31/02 B23K1/00 H05K3/34 

FIELD: electrical engineering.

SUBSTANCE: surfaces of parts to be soldered together are preliminary wetted with saturated water solution of soldering flux. Mix of phosphorus-containing copper-based solder with powder of said flux is arranged between the parts, said mix representing a minced chips with particle size of 0.5 to 1 mm. Flux amount in said max makes 3 to 8 wt %. Electrodes press the parts together to heat them to soldering temperature by passing electric current through electrodes, parts and solder. Temperature of 800 to 820°C reached, aforesaid solder representing a wire element is introduced in joint along contact outline till the end of soldering.

EFFECT: higher strength and quality of soldered connection.

1 dwg, 1 ex