METHOD OF MAKING TIN-BASED SOLDER Russian patent published in 2015 - IPC B23K35/40 B23K35/26 C22C13/00 

FIELD: process engineering.

SUBSTANCE: invention can be used at production of quick lead-free solders for soldering of electronics components and structural materials. Flux based on organic compounds is added to the mix of tin, silver, copper and phosphorus as, for example, copper-phosphorus alloy and heated to 700-800°C. Then, germanium and flux based on slat systems is added to obtained melt and cured for 5-10 minutes. It is first cooled at the rate of not over 10°C/s to 550-600°C with holding thereat for 10-15 minutes and, then at the rate of at least 10°C/s to the room temperature. Quantitative ratio of components is selected from relationship (wt %): Ag - 1.5, Cu - 0.7-3.0, Ge - 0.01-0.3, P - 0.1-0.3, Sn making the rest.

EFFECT: during extra holding intermetallide compounds are formed in solder matrix to add to hardening effects.

2 cl