FIELD: information technology.
SUBSTANCE: first, a hole is made on a universal card on integrated circuits provided by a first service provider and the universal card on integrated circuits can include a first integrated circuit and first connection pads connected to the first integrated circuit. This hole is made using a hole puncher. After that a card with a multilayer integrated circuit is connected to the universal card on integrated circuits of a second service provider to form a double universal card on integrated circuits. Such a card with a multilayer integrated circuit can have a second integrated circuit and second connection pads connected to the second integrated circuit and the second integrated circuit is put in the hole. The size of the second integrated circuit or the casing protecting the second integrated circuit exactly matches the hole, thus ensuring high reliability.
EFFECT: possibility of providing and additional service based on increasing level of security on a double universal card on integrated circuits through wireless transmission or reception of data by a cellular telephone.
24 cl, 7 dwg
