SOLDERED SYSTEM WITH MATCHED THERMAL EXPANSION FACTORS (TEF) Russian patent published in 2010 - IPC B23K35/02 B23K1/00 

Abstract RU 2403136 C2

FIELD: process engineering.

SUBSTANCE: invention can be used for producing strong gastight joint wherein at least one joint element contains ceramic material or cermet to seal solid-oxide fuel element. Solid solder non-pored composition contains the alloy of solid solder in the form of powder or parts, or in volumetric form, mixed with one or more fibrous fillers with low, i.e. not exceeding TEF of 6×10-6 1/K, or negative TEF. Note here that solid solder composition features TEF approximating to (8-15)×10-6 1/K. Invention covers also the multicomponent element brought about by mixing two or more elements with nonporous composition.

EFFECT: reduced thermal strain originating due to mismatched TEFs.

41 cl, 4 dwg, 1 ex

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RU 2 403 136 C2

Authors

Taker Majkl S.

Jakobson Krejg P.

De Jonge Ljutgard S.

Dates

2010-11-10Published

2005-11-23Filed