FIELD: process engineering.
SUBSTANCE: invention relates to soldering, particularly, to development of solder optimum shape, release and composition used in soldering tungsten and its alloys with copper and its alloys, for example, energy-intensive assemblies on nuclear power engineering. Proposed solder represents a flexible tape with amorphous structure from copper-based alloy containing in wt %: titanium - 25-31, beryllium - 0.1-3, copper making the rest. Said flexible tape features width of 10-40 mm and thickness of 40-50 mcm and unlimited length. It is made by superfast quenching at the rate of 104-106 deg. C/s to produce amorphous structure of alloy.
EFFECT: higher quality and thermo mechanical properties.
4 cl, 3 tbl, 10 dwg
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