FIELD: chemistry.
SUBSTANCE: composition contains the following (wt %): epoxy diane resin ED-20 51.81-63.82, mineral filler 15.54-19.16, ethylene diaminomethylphenol amine hardener 8.81-10.85, isopropylbenzene hydroperoxide 0.26-1.04, NK-1 accelerator 0.70-2.07 and antipyrene - phosphorus-containing methacrylate 5.21-20.73 of formula:
, where: x=1.2.
EFFECT: invention improves technological effectiveness of the antipyrene pre-synthesis process, enables to obtain chemically resistant epoxy diane compositions with low flammability and good physical and mechanical properties.
2 tbl, 6 ex
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Authors
Dates
2011-02-20—Published
2009-07-27—Filed