FIELD: process engineering.
SUBSTANCE: proposed method is tended for producing contactless card comprising support of antenna etched thereon and electronic module, or integrated circuit (IC) connected to two outputs of said antenna, and, at least, two bodies of the card on both sides of said antenna support. Said bodies are thermoplastic sheets hot-pressed together to be applied on antenna support surface that incorporates said electronic module or IC. Said thermoplastic sheet is perforated by through cavity. Note here that sheet thickness exceeds that of IC. Note also that said cavity is arranged to allow IC be located inside said cavity. Thermoplastic sheet is arranged on said support prior to lamination. Therefore said IC is not subjected to pressure at lamination stage.
EFFECT: ruling out IC straining that may cause IC damage.
13 cl, 4 dwg
