ELECTRONIC-MODULE DATA MEDIUM AND ITS MANUFACTURING PROCESS Russian patent published in 2001 - IPC

Abstract RU 2169389 C2

FIELD: single-layer or multilayer data media with built-in electronic modules such as chip-cards. SUBSTANCE: dimensions of card body comply with ISO 7810 Standard; it is made of layers of paper and/or pressboard joined together by means of heat-activated or contact adhesives. Cards may be manufactured using strip reeled off coils when separate layer of card is produced from strip reeled off respective coil; layers are provided with ports required to receive module. For the final procedure, layers are joined together. Modules are placed in depressions formed in the process and separate cards are cut by sheet stamping method. EFFECT: reduced cost of chip manufacture. 32 cl, 25 dwg

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RU 2 169 389 C2

Authors

Khagiri Jakhua

Ojster Al'Bert

Barak Rene-Lusija

Dates

2001-06-20Published

1995-02-03Filed