FIELD: hybrid cards production.
SUBSTANCE: besides method includes first lamination implying meltback of two thermoplastic plates on both sides of antenna support at temperature high enough to make thermoplastic plates soft and flowing to remove thickness differences relative to support; and second lamination executed after period of time required for hardening of thermoplastic plates. Second stage mentioned implies hot pressing meltback of two plastic layers (forming body of card characterizing by equal thickness of antenna support plasticized with mentioned thermoplastic plates on plasticized and even surfaces).
EFFECT: elimination of unevenness after lamination of card owing to method enabling to provide quite even antenna support for noncontact or contact/noncontact hybrid cards with built-in IC.
13 cl, 8 dwg
