SOLDERED JOINT OF PRINTED CIRCUIT BOARDS Russian patent published in 2011 - IPC H05K1/11 H05K3/34 

FIELD: electricity.

SUBSTANCE: in a soldered joint of a flexible printed circuit board with a stiff printed circuit board in the form of a contact unit, comprising at least two metallised contacts joined with current-conducting paths, arranged on surfaces of switching layers, made on the basis of the dielectric material matched with each other and joined with each other by electrically and mechanically electroconductive binding material, metallised contacts of the flexible printed circuit board are made with at least one bend, the flat surface and the bend form an electric contact with the stiff printed circuit board to form a hollow chamfer from electroconductive binding material at the side of the bend.

EFFECT: development of high-quality and reliable soldered joint of the flexible printed circuit board with the stiff printed circuit board without removal of dielectric material in the zone of soldering.

4 cl, 5 dwg