MULTILAYER SWITCH-OVER BOARD (OPTIONS) Russian patent published in 1999 - IPC

FIELD: microelectronic and semiconductor devices for manufacturing printed-circuit boards, switching devices, and single-chip modules. SUBSTANCE: switch-over structure has insulating layers with current-carrying tracks on their surfaces which are, essentially, switch-over layers; contact assemblies in the form of metallized contacts joined together, electrically and mechanically interconnected by means of conducting material; contact assemblies are made in the form of contact-to-contact joints. Other version of board is distinguished by current-carrying tracks arranged on either side of switch-over layer and coupled together through metallized transition holes within each layer. EFFECT: increased specific compactness of connections, reduced labor consumption and cost. 8 cl, 3 dwg