FIELD: soldering techniques.
SUBSTANCE: invention relates to soldering in particular to the methods of flux-free soldering of dissimilar materials which can be applied to joining the details of assembled baseplates, thermo and solar batteries, optoelectronic and radioelectronic equipment; the method includes layer-by-layer coating of the joint surfaces with metallic copper and metallic gallium followed by thermo processing of the joint surfaces at the temperature of 70-150°C at that the layer of the metallic copper and the layer of the metallic gallium are smeared by means of the electrolysis in turns in two stages, at that the two stages of the electrolysis are performed at the similar cathodic current density within the range of 2.5-5.7 A/dm2 and the relation of the time of the electrolysis of the first and the second stage equal to τCu : τGa= 5÷3 : 4÷2.
EFFECT: method provides the possibility of attainment of the soldered seam of the regulated thickness upon the absolutely equal coating of the soldered surfaces, at that the simple tools are applied - the electrolysis cell and drying closet.
1 dwg, 3 ex
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Authors
Dates
2012-02-20—Published
2010-12-08—Filed