METHOD OF PRODUCING DOPED SOLDER Russian patent published in 2012 - IPC B23K35/40 

FIELD: process engineering.

SUBSTANCE: invention may be used in production of doped tin-lead solders intended for printed circuit board fabrication. Processed solder, e.g. POS-61, and its slimes are fed via loading opening 2 of device for deoxidation and fusion in flux-master alloy 5. In zone 3 of complex doping, said solder is mixed for leveling master alloy composition by means of fan driven by motor 1 at 15-30 rpm. In doping, flux-master alloy is continuously fed into zone 3 from dispenser 4 to keep its level constant for doping purposes. Zone 3 temperature is maintained by heater 6 to make 195-205°C. Thermocouple 8 is used to control operating temperature. Complex doping by protective compound is performed for 1-1.5 min. Then, solder is removed from the device via drain hole 17 and cooled down to crystallisation temperature.

EFFECT: complex reduction and doping of lead-tin solder in entire treated volume.

1 dwg, 1 tbl