SOLDERING PASTE Russian patent published in 1997 - IPC

Abstract RU 2080972 C1

FIELD: electronic and radio engineering; mounting of electronic devices by stencilling. SUBSTANCE: soldering paste contains the following components, mas.%: rosin, 4.7-5.3; pine oil, 2-3.5; ethylcellosolv, 1.3-3, boric acid, 0.5-1; tin-lead solder powder, the balance. EFFECT: improved quality of soldering. 1 tbl

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RU 2 080 972 C1

Authors

D'Jakov Vitalij Evgen'Evich

Dates

1997-06-10—Published

1994-05-25—Filed