SOLDER PASTE Russian patent published in 2008 - IPC B23K35/36 B23K35/363

Abstract RU 2337800 C1

FIELD: physics.

SUBSTANCE: solder paste consists of following components in given ratio, wt %: tin-lead solder 83.125 - 91.875, pine oil 2.565 - 2.835, ethyl cellosolve 1.368 - 1.512, ethyl cellulose 0.1197 - 0.1323, common resin 4.4973 - 4.9707, acetic acid 0.8645 - 0.9555, triethylamine 2.4605 - 2.7195.

EFFECT: optimum combination of printing and adhesive parameters with complete exclusion of process of washing obtained joints after soldering.

3 tbl

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RU 2 337 800 C1

Authors

Diev Igor' Serafimovich

Dates

2008-11-10—Published

2007-02-22—Filed