FIELD: metallurgy.
SUBSTANCE: proposed method comprises bringing metal substrate in contact with pretreatment composition including metal of IIIB and/or IVB group, electrically positive metal, say, water-soluble copper compound, unbound fluorine, fluoride of metal, e.g. lanthanum, scandium or combination thereof with pKsp making, at least, 11, and water, wherein metal with fluoride pKsp of 11 is present in amount sufficient for content of unbound fluorine in composition making, at least, 0.1 ppm and not over 300 ppm.
EFFECT: pretreatment composition not containing chromate- and phosphate-ions.
18 cl, 1 tbl, 3 ex
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