SOLDER STICK WITH LATTICE-STRUCTURE SURFACE Russian patent published in 2012 - IPC B23K3/02 

FIELD: process engineering.

SUBSTANCE: solder stick 1 comprises heat generating or conducting main part 4. Contact surface 11 is arranged on its outer side to be wetted by tin solder 12. Crystalline lattice structure of said contact surface 11 and that under said surface have charged particles of, at least, one impurity material imbedded therein. Impurity metal is selected from the group including platinum, tungsten, molybdenum, titanium, nickel, cobalt, germanium, silicon, arsenic, gallium, nitrogen and carbon. Said charged particles may be imbedded to depth of 0.3 mm, preferably, to 1.0 mm. Concentration of charged particles under contact surface 11 may vary with increase in depth. Distribution of particles may be either uniform or with varying density. Barrier layer may be arranged between main part 4 and contact layer 7. Protective coat 14 may be made on contact surface sections.

EFFECT: mechanical stability, better wettability flow characteristics.

17 cl, 2 dwg