HIGHLY STRONG SOLDER ALLOY Russian patent published in 1999 - IPC

Abstract RU 2132265 C1

FIELD: solder operations. SUBSTANCE: solder alloy comprises, wt %: silicon, 0.0005- 0.0008; tin, 20.0-95.0; silver, 0.001-5.0; bismuth, 0.001-10.0, and lead, the balance. EFFECT: high mechanical strength and superior wetting properties of the solder alloy.

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RU 2 132 265 C1

Authors

Toranosuke Kavaguti

Takajuki Khajasi

Dates

1999-06-27—Published

1995-03-23—Filed