FIELD: chemistry.
SUBSTANCE: described is an adhesive composition for gluing to metal, containing: (a) at least one methacrylate radical polymerisation monomer; (b) an ambient temperature radical polymerisation initiator system containing at least one oxidant and at least one reducing agent; (c) a photoinitiator; and (d) an epoxy compound; where the adhesive will at least partially solidify at temperature between 10 and 40°C through a radical polymerisation catalyst system which is activated at ambient temperature. Described also is a two-component curing adhesive for gluing to metal, containing: (a) a first component containing (i) at least one methacrylate radical polymerisation monomer, (ii) at least one reducing agent and (iii) a photoinitiator and (b) a second component containing an oxidant which is reactive at ambient temperature with respect to the reducing agent and forms free radicals capable of initiating radical polymerisation and facilitate chain growth, and an epoxy compound; where the adhesive will at least partially solidify at temperature between 10 and 40°C through a radical polymerisation system activated at ambient temperature.
EFFECT: obtaining an adhesive which does not require additional heat for initiating curing.
24 cl, 6 ex
