FIELD: machine building.
SUBSTANCE: grip contains a clamping ring connected to controlled robot arm and to impact washer with gripping surface connected with continuous flow system due to which after delivery of excess pressure to Bernoulli grip vacuum for suction of gripped semiconductor wafer is generated near gripping surface of impact washer. Grip also contains a trunnion ring rubber locating surface integrated in gripping surface for non-sliding movement of semiconductor wafer sucked to gripping surface.
EFFECT: for provision of most sparing relative to blow contact of gripped semiconductor wafer with gripped surface damping device adapted by perimeter is provided, it creates damping resistance for gripped semiconductor wafer.
7 cl, 4 dwg
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