FIELD: process engineering.
SUBSTANCE: invention relates to multilayer thermoplastic film structures to be applied to paper or cardboard in layers. Film structure comprises, at least, two layers. One layer comprises polypropylene homopolymer. Second layer features thickness of, at least, three microns and includes polyolefin material with melting point of 90°C to 105°C.
EFFECT: film structure suitable for application on paper and cardboard with no solvent or glue.
10 cl, 5 ex
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Authors
Dates
2013-02-20—Published
2008-10-17—Filed