FIELD: process engineering.
SUBSTANCE: invention relates to vacuum, electronic and electric-bulb production. Cermet solder comprises aluminium oxide, calcium oxide, magnesium oxide, tungsten oxide, niobium oxide, zirconium oxide, niobium, titanium and tungsten.
EFFECT: higher thermal and adhesion properties.
1 tbl
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RU2182163C2 |
Authors
Dates
2013-07-10—Published
2011-09-07—Filed