FIELD: radio engineering, communication.
SUBSTANCE: module has a multilayer printed-circuit board with N conducting layers and plated holes, through which interlayer electrical connections are made, which carries high-frequency and low-frequency connectors, as well as conductor strips and radio components which are grouped into analogue and digital signal processing zones. The screening plane of the analogue signal processing zone is located in the n-th conducting layer. The screening plane of the digital signal processing zone is located in the neighbouring (n+1)-th conducting layer. The earthing plane of the digital signal processing zone is connected through a plated hole, which forms the earth potential input line into the analogue signal processing zone from the digital signal processing zone, with the earth potential input section, located in the first conducting layer, into the analogue signal processing zone which is connected to the surrounding earthing section at one point by a zero resistance resistor. Said plated hole crosses the screening plane and the earthing sections of the digital signal processing zone to provide electrical contact with them, and the screening plane and crosses the earthing sections of the analogue signal processing zone without electrical contact with them.
EFFECT: designing a new version of the module, which widens the existing range of modules that are characterised by arranging the analogue and digital signal processing zones on below the other on different sides of a multilayer printed-circuit board and mutual screening by on-board means.
13 dwg
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Authors
Dates
2013-08-10—Published
2012-05-12—Filed