FIELD: radio engineering.
SUBSTANCE: module contains multilayer electronic board with N conductive layers, carrying high frequency and low frequency connectors, and also imprinted conductors and electric radio-elements, grouped in zones of analog and digital signals processing, while first one of aforementioned zones occupies conductive layers from first to n-numbered, and second one is positioned below the first one and occupies conductive layers from (n+1)-numbered to N-numbered, where n ≥ 5, N-n ≥ 5. Inter-layer electric connections in each zone are realized by means of solid transition apertures, and inter-layer electric connections between zones are realized by means of through transition apertures. In n-numbered and (n+1)-numbered conductive layers, screening planes are positioned, connected by appropriate through transition apertures to one another and to screening imprinted conductors, positioned along perimeters of zones for analog and digital signals processing in conductive layers from first to (n-1) and from (n+2) to N respectively, and also to ground planes of these zones, positioned respectively in i-numbered conductive layer between first and n-numbered conductive layers and in k conductive layer between (n+1) and N conductive layers. Ground plane of zone for digital signals processing is electrically connected to "Ground" clamp of low frequency connector. "Power" clamp of low frequency connector through input power filter is electrically connected to input clamps of voltage generators of digital and analog power, output clamps of which are electrically connected to, respectively, digital power plane and common point of analog power conductors.
EFFECT: creation of one-board construction with positioning of zones for analog and digital signals processing one below the other on different sides of multi-layer electronic board and provision of in-board electromagnetic compatibility under said conditions.
2 cl, 16 dwg
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Authors
Dates
2006-11-20—Published
2005-06-06—Filed