SIGNAL RECEIVER MODULE FOR SATELLITE RADIO NAVIGATION SYSTEMS Russian patent published in 2006 - IPC H05K1/11 H05K3/46 H05K9/00 

FIELD: radio engineering.

SUBSTANCE: module contains multilayer electronic board with N conductive layers, carrying high frequency and low frequency connectors, and also imprinted conductors and electric radio-elements, grouped in zones of analog and digital signals processing, while first one of aforementioned zones occupies conductive layers from first to n-numbered, and second one is positioned below the first one and occupies conductive layers from (n+1)-numbered to N-numbered, where n ≤ 5, N-n ≤ 5. Inter-layer electric connections in each zone are realized by means of solid transition apertures, and inter-layer electric connections between zones are realized by means of through transition apertures. Each zone is surrounded along perimeter by screening imprinted conductors. In each zone screening imprinted conductors are connected by appropriate solid transition apertures to each other and to additional screening planes. Also, screening imprinted conductors, positioned in first and n conductive layers, are connected by electro-conductive straps to first and second ground portions, positioned on same conductive layers, electrically connected to ground surfaces of native zones. First ground portion, belonging to zone for analog signals processing, is connected to ground plane of digital signals processing zone by means of appropriate through transition aperture. Ground plane of zone for digital signals processing is electrically connected to "Ground" clamp of low frequency connector. "Power" clamp of low frequency connector through input power filter is electrically connected to input clamps of voltage generators of digital and analog power, output clamps of which are electrically connected to, respectively, digital power plane and common point of analog power conductors.

EFFECT: creation of one-board construction with positioning of zones for analog and digital signals processing one below the other on different sides of multi-layer electronic board and provision of in-board electromagnetic compatibility under said conditions.

2 cl, 17 dwg