FIELD: information technology.
SUBSTANCE: server farm consists of a sealed reservoir filled with liquid coolant, equipped with a cover, an inlet and an outlet linked by pipes to a circulation pump and a heat exchanger. A perforated distribution pipe is placed inside the reservoir parallel to the entire bottom of the reservoir. A first printed-circuit board, which is equipped with heating elements, is placed underneath. A second printed-circuit board is mounted tightly to the wall of the reservoir and is mated with the first printed-circuit board edge to edge. Computational nodes are mounted on the first printed-circuit board in parallel to the second printed-circuit board and consist of a mounting printed-circuit board which is divided by a divider into a narrow compartment and a wide compartment. The narrow compartment is fitted on both sides with a detachable printed-circuit board which is fitted with a power supply unit, information storages, and the wide compartment is fitted with a motherboard on each side. Half the information storages on the detachable printed-circuit board, mounted on one side of the mounting printed circuit-board, are connected to the motherboard on that side, and the other half are connected to the motherboard on the other side. There is complete mirroring of data between information storages connected to one motherboard.
EFFECT: high density of installing computational nodes.
15 cl, 9 dwg
Title | Year | Author | Number |
---|---|---|---|
SERVER FARM WITH IMMERSION COOLING SYSTEM | 2012 |
|
RU2500012C1 |
SERVER FRAME WITH IMMERSION COOLING SYSTEM | 2013 |
|
RU2559825C2 |
DEVICE FOR COOLING ELECTRONIC PRODUCTS | 2017 |
|
RU2663213C2 |
MODULAR SUBMERSIBLE COOLING SYSTEM | 2016 |
|
RU2621360C1 |
COMPUTER CLUSTER WITH SUBMERGED COOLING SYSTEM | 2016 |
|
RU2632400C1 |
IMMERSION COOLING SYSTEM OF SERVER EQUIPMENT | 2019 |
|
RU2692569C1 |
SINGLE-PHASE IMMERSION COOLING SYSTEM FOR SERVER CABINETS | 2021 |
|
RU2787641C1 |
DEVICE FOR CHECKING LIQUID FLOW METERS | 2023 |
|
RU2810628C1 |
SYSTEM FOR DIRECT LIQUID COOLING OF ELECTRONIC COMPONENTS | 2017 |
|
RU2695089C2 |
GAS CLEANING PLANT | 1991 |
|
RU2084270C1 |
Authors
Dates
2013-10-20—Published
2012-07-02—Filed