FIELD: machine building.
SUBSTANCE: magnetron sputtering assembly includes a sputtering target and a flat magnetic system. Flat magnetic system is installed on a carrier with its rotation actuator about the axis perpendicular to surface of the sputtering target. At least one carrier at least of one flat magnetic system has its rotation drive about an additional axis parallel to the carrier rotation axis. At least one flat magnetic system is installed on the magnetic system carrier with an offset relative to the additional axis. Rotation speeds of the magnetic system about the first and the second axes are changed as per the specified programme.
EFFECT: uniform sputtering of a target, increasing the degree of utilisation of the target material and sputtering speed increase.
8 cl, 3 dwg
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