COOLING MODULE FOR COOLING OF ELECTRONIC ELEMENTS Russian patent published in 2014 - IPC H01L23/427 

FIELD: heating.

SUBSTANCE: subject of this invention is cooling of power electronic elements, and namely a cooling module containing a condenser and a power module included in the cooling module and a cooling method of electrical and/or electronic elements. Cooling module (100) with condenser (1) includes at least one panel (11) for cooling of electrical and/or electronic elements. Two plates (114, 115) of panel (11) are connected to each other by means of rolling so that channel (113) is formed between these plates (114, 115). Channel (113) is located in the plane between two plates (114, 115). Heat transfer channel (113) is filled with cooling agent (5). Cooling is performed by evaporation of cooling agent (5) in an evaporative section of panel (11) and condensation of cooling agent (5) in a condensation section of panel (11). A heat load can be transferred from heat source (3), such as an electrical and/or electronic element, to heat-receiving unit (2, 2A, 2B). Heat-receiving unit (2, 2A, 2B) is intended for heat load transfer to panel (11) that transmits the heat load to atmosphere by means of heat carrier, such as air (4).

EFFECT: reducing probable contamination of cooling air passages and improving cooling efficiency.

25 cl, 36 dwg