CHIP BOARD AND METHOD OF ITS MAKING Russian patent published in 2014 - IPC B27N3/04

Abstract RU 2524819 C2

FIELD: process engineering.

SUBSTANCE: invention relates to laminar material such as laminar chip boards and to method of its fabrication. Third board has at least three wood layers. At least one mid layer consists of the mix of wood material and foamed plastic (3). Additionally, it comprises at least one foamed natural material (4).

EFFECT: good mechanical and technical parameters, lower emission of aldehydes.

17 cl, 3 dwg

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RU 2 524 819 C2

Authors

Joakhim Khash

Dirk Grunval'D

Dates

2014-08-10—Published

2010-02-24—Filed