FIELD: chemistry.
SUBSTANCE: acid electrolyte for silvering contains silver nitrate, used as a soluble compound, sulphamic acid and thiourea, used as reagents, providing the electrolyte stability, structure-forming additives in the form of gelatin, a non-ionogenic surface-active substance and one or several types of products from mercapto compounds, and it contains the said components in a water solution, which has pH from 0 to 3, with the following ratio, g/l: silver nitrate (by Ag) 10-20, sulphamic acid 10-20, thiourea 130-150, gelatin 0.5-1.5, non-ionogenic surface-active substance 1-3, one or several types of products from mercapto compounds 0.1-1.0.
EFFECT: creation of the acid silvering electrolyte, providing precipitation on printed circuit boards of a dense homogeneous fine crystalline coating, which has no external defects and does not cause destruction and detachment of an organic photoresist film in the process of the coating application.
4 ex
| Title | Year | Author | Number | 
|---|---|---|---|
| SILVERING ELECTROLYTE | 2019 | 
 | RU2702511C1 | 
| SILVER-PLATING ELECTROLYTE | 2006 | 
 | RU2323276C2 | 
| SILVER-PLATING ELECTROLYTE | 0 | 
 | SU679649A1 | 
| METHOD OF PRODUCING ELECTROCHEMICAL SILVER COATING | 2015 | 
 | RU2599471C1 | 
| PYROPHOSPHATE-AMMONIUM ELECTROLYTE OF CONTACT SILVERING | 2017 | 
 | RU2661644C1 | 
| SILVER PLATING ELECTROLYTE | 2016 | 
 | RU2652681C2 | 
| SOLUTION FOR THE CHEMICAL SILVERING OF COPPER ALLOYS AND A METHOD OF ITS PRODUCTION | 2016 | 
 | RU2625149C1 | 
| PROCESS OF MANUFACTURE OF ELECTRICALLY PRECIPITATED COPPER FOIL AND COPPER FOIL PRODUCED BY THIS PROCESS | 1996 | 
 | RU2166567C2 | 
| SILVER-PLATING ELECTROLYTE | 0 | 
 | SU603709A1 | 
| METHOD OF MAKING PHOTOCONVERTER CONTACTS | 2007 | 
 | RU2357326C1 | 
Authors
Dates
2014-12-20—Published
2010-03-09—Filed