POLYAMIDE FILMS FOR FLEXIBLE PRINTED CIRCUIT BOARDS Russian patent published in 2015 - IPC C08J5/18 C08L77/06 C08L77/10 C08G69/26 B32B27/34 H05K1/00 H05K1/03 H05K1/14 B29C55/00 

FIELD: chemistry.

SUBSTANCE: invention relates to polymer films, intended for application in field of electrical engineering, in particular, as carrier of flexible printed circuit boards. Described is subjected to biaxial stretching polymer film, obtained from polyamide composition, which contains at least 80 wt % counted per the total weight of polymer composition of semi-crystalline semi-aromatic polyamide, which has melt temperature (Tm), equal to at least 300°C. Polymer film is characterised by average coefficient of thermal expansion in plane in temperature range 20°C-Tg, measured in plane by method, corresponding to ASTM D969-08, and equal, to at least, 40 ppm/K. Semi-crystalline semi-aromatic polyamide contains repeating units, produced from dicarboxylic acid, consisting of 70-100 mol. % of terephthalic acid, diamines, and other repeating units in quantity 0-5 mol. %. Also described is method of polymer film obtaining, application of polymer film as belt carrier in production of printed circuit boards, as flexible carrier. Flexible printing board, electronic system or printed circuit board in assembly is described.

EFFECT: stability of geometric dimensions, resistance to high temperature and good dielectric properties of polymer films.

13 cl, 2 tbl, 2 ex