METHOD OF SOLDERING, GYROSCOPE AND SOLDERED UNIT Russian patent published in 2015 - IPC B23K1/00 B23K1/19 

FIELD: technological processes.

SUBSTANCE: invention may be used in manufacturing of a unit by lead-free soldering, which comprises a substrate (4,28) and at least a partially electroconductive body (2,34), for instance, in manufacturing of a gyroscopic sensor. The substrate may be made, for instance, from a silicon dioxide, silicon, ceramics, metal oxides, crystalline materials or glass. Metallisation of the substrate (4) is carried out by deposition of a connecting layer (8) and deposition of a diffused barrier layer (12). The connecting layer (8) is made of chrome, titanium or titanium alloy. The diffused barrier layer (12) is made from platinum or palladium. A wetting layer from gold absorbed by a solder is applied onto the diffused barrier layer (12) before application of the solder. A solder from tin-silver alloy or tin-silver-copper alloy is applied between the electroconductive body and metallised substrate. All deposited layers are made as thin-film.

EFFECT: invention provides for high-quality connection of non-soldered materials.

13 cl, 3 dwg