METHOD OF VACUUM-TIGHT SOLDERING OF CERAMICS WITH METALS AND NON-METALS Russian patent published in 2020 - IPC B23K1/00 B23K1/19 B23K103/18 

Abstract RU 2722294 C1

FIELD: physics.

SUBSTANCE: invention relates to production of a soldered joint of an electrovacuum device assembly comprising parts made of ceramics and metal and can be used in electronic, radio engineering and precision instrument making. Between soldered parts of the assembly parts solder is arranged, unit is heated in electric vacuum furnace and cooled. Solder is used in form of foil from eutectic copper-silver alloy, on surface of which on both sides there is a layer of titanium. Method can be implemented on extended vacuum tube thermal equipment.

EFFECT: technical result consists in obtaining a sealed soldered weld in helium over 2 × 10-12 Pa·m3/s while reducing labour input of the soldering process.

1 cl, 4 ex

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RU 2 722 294 C1

Authors

Malygin Valerij Dmitrievich

Rusin Mikhail Yurevich

Terekhin Aleksandr Vasilevich

Pokrovskij Evgenij Nikolaevich

Atyunina Svetlana Aleksandrovna

Dates

2020-05-28Published

2019-02-25Filed