METHOD OF SOLDERING LASER DIODES Russian patent published in 2019 - IPC B23K1/05 B23K35/26 H01L21/02 H01L21/58 

FIELD: metallurgy.

SUBSTANCE: connecting first body 1, which is a heat-removing base, and second body 5, which is a laser diode, using composite solder 4, which is formed from the initial gold layer 4.1 and is applied on an auxiliary layer consisting of adhesive layer 2, adjacent to upper surface of heat-removing base 1, and barrier layer 3. Connection is performed under effect of heat and pressure sufficient for melting of composite brazing alloy 4, which is formed from basic thickness-thick layers of gold, which are first 4.1, intermediate 4.3 and finish 4.5 solder layers, which are separated with two multilayers 4.2 and 4.4. Multilayers 4.2 and 4.4 form step-by-step application of alternating layers of gold and tin in accordance with step-by-step procedure: n-number of tin layers and (n-1) -large number of gold layers, starting from tin, are successively applied on first layer of solder alloy 4.1. Ratio of thickness in multilayers 4.2 and 4.4 between gold layer and tin layer is equal to 1.25, total thickness of one layer of tin from multilayers 4.2 and 4.4 with one layer of gold from multilayers 4.2 and 4.4 is not less than 100 nm, but not more than 270 nm, and n-number of tin layers in multilayers 4.2 and 4.4 and thickness h of base thickness-thick layers of gold 4.1, 4.3 and 4.5 are determined from given mathematical expressions.

EFFECT: invention can be used for soldering semiconductor laser emitters.

6 cl, 1 dwg