METHOD AND DEVICE FOR REFLOW SOLDERING Russian patent published in 2015 - IPC B23K1/15 H05K3/34 

FIELD: process engineering.

SUBSTANCE: invention can be used for connection of elements with circuit board by reflow soldering. Device (10) comprises evaporator chamber (12) communicated with vessel (16) filled with heat conducting fluid (18) which when heated creates and maintains the volume of evaporated fluid (18). For reflow soldering, transferred vapours and/or condensate transfer heat to heating chamber (14) that houses said circuit board (24). Transfer mechanism carries vapours or condensate from evaporated fluid (18) into heating chamber (14). Besides, it comprises actuator to develop pressure difference between evaporation chamber (12) and heating chamber (14). Evaporation chamber is connected with heating chamber via channels. Second channel communicates evaporation chamber top end with heating chamber. Blower arranged in second channel transfer vapours from vapour ply via first channel to heating chamber by driving air above vapour ply to allow control over vapour rate and amount of fed heat.

EFFECT: updates quality of soldered connections.

21 cl, 3 dwg