METHOD FOR OBTAINING COPPER-CONTAINING MATERIAL IN FORM OF METAL SUBSTRATE WITH COPPER MICROPARTICLES APPLIED ON IT Russian patent published in 2016 - IPC B32B15/20 B32B5/16 C25C5/02 B22F9/24 

FIELD: chemistry.

SUBSTANCE: electric precipitation is performed onto metal substrate of monolayer of icosahedral copper microparticles with size from 5 mcm to 15 mcm, possessing six axes of fivefold symmetry, from electrolyte in form of copper sulphate solution under overvoltage 30-150 mV. Annealing of metal substrate with obtained monolayer of copper microparticles is carried out in air atmosphere at temperature 150-210°C and exposure time from 15 minutes to 1.5 hours with formation of oxide layer on the surface of copper microparticles. After that, metal substrate is placed horizontally in solution, which contains hydrochloric acid, iron chloride FeCl₃ and distilled water, and chemical etching of obtained microparticles is realised for 10-100 s at temperature 15-50°C, providing formation of developed surface of microparticles in form of internal cavities and/or corrugated relief.

EFFECT: good adhesion of copper microparticles to substrate.

2 cl, 4 dwg