METHOD FOR ELECTRODEPOSITION OF COPPER Russian patent published in 2008 - IPC C25D3/38 C25D1/04 

Abstract RU 2322532 C2

FIELD: metallurgy, possibly production of materials with specific structure and special properties, for example in the form of coatings, films or powders containing pentagonal crystallites characterized by high adsorption capability.

SUBSTANCE: method comprises steps of depositing copper from electrolyte where two electrodes are placed. One electrode is made of copper and it is used as anode. As second electrode - cathode - electrically conducting substrate made of material with low heat conductance and roughness is used. Relation of anode surface area to cathode surface area is no less than 1 : 10; deposition is realized at electric current density in range 0.01 - 0.1 A/dm2 for forming nano-size crystals with quinary symmetry on base of non-crystalline seeds.

EFFECT: possibility for depositing copper coatings or films with high adsorption capability.

4 cl, 3 dwg, 1 ex

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RU 2 322 532 C2

Authors

Vikarchuk Anatolij Alekseevich

Jasnikov Igor' Stanislavovich

Tjur'Kov Maksim Nikolaevich

Dovzhenko Ol'Ga Aleksandrovna

Dates

2008-04-20Published

2006-01-10Filed