INSTALLATION OF LOW-TEMPERATURE SOLDERING IN LIQUID HEAT CARRIER Russian patent published in 2016 - IPC B23K3/06 B23K1/08 

FIELD: metallurgy.

SUBSTANCE: invention can be used in low-temperature soldering in liquid heat carrier parts soft solders, particularly frames for housings of microassemblies of microwave range. Each of two baths of the device is made in the form of cube and is arranged in the housing with heat insulation. Heating devices are arranged: one is on the rear wall and other is on the front wall of each chamber and two are at the bottom. On side walls of chamber of bath for preliminary heating of parts there are atomisers for supply of nitrogen in it. In soldering bath chamber there is liquid heat carrier. Chambers are arranged in the housing of the plant, closed tight top cover with illumination. Front wall of the housing is transparent to displace vertically. Pipe is attached to condensation device, this pipe is connected to ventilation via flange and is closed with coolant condensate collector reservoir connected with chamber soldering via bend.

EFFECT: technical result is improvement of quality and as a result, reliability of connection of parts that provides higher yield.

1 cl, 1 dwg