FIELD: geography.
SUBSTANCE: invention can be used in three-dimensional high-resolution seismic explorations of the sea bed for engineering survey. Concept: system of 3D examination of sea bed for engineering survey comprises at least one seismic irradiator and at least one seismic cable, sound velocity sensor, multi-beam echo sounder, side-scanning sonar, high-frequency and low-frequency parametric profilographs, multi-beam echo sounder, whose outputs are connected by common bus with data collection unit, one of the outputs of which is connected by common bus with inputs of seismic irradiator and seismic cable, sound velocity sensor, multi-beam echo sounder, side-scanning sonar, high-frequency and low-frequency parametric profilographs, and the other output of data control and analysis is connected to data primary processing unit, connected to data visualisation unit connected with unit of obtained data construction in 3D format. Method of 3D examination of sea bed for engineering survey includes collection of information about sea bed topography and upper layers of bottom sediments, collection of data about structure of deep layers of bottom sediments, collection of data about propagation speed of seismoacoustic signals using sound speed sensors in water and multichannel seismoacoustic profiling, further primary processing of said data and analysis of seismoacoustic signal data in real and near-real time, combination of obtained data on time and coordinates, that is followed by secondary data processing using computer tools equipped with means for three-dimensional imaging and simulation, results of processed data is used to construct 3D model of high relief of sea bed, top and deep layers of bottom sediments, based on analysis of which seismic and geotechnical properties of bottom sediments with extraction of abnormal areas is performed.
EFFECT: technical result: upgraded reliability of results of sea bed analysis due to increased depth and resolution at complex engineering surveys.
12 cl, 2 dwg
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Authors
Dates
2017-01-17—Published
2015-03-16—Filed