FIELD: chemistry.
SUBSTANCE: invention relates to chemical engineering, particularly, to development of adhesive composition for connection of metal and non-metallic materials. Epoxy resin used in adhesive composition is epoxy resin KDA, consisting of epoxy-diane resin ED-20, modified with epoxy aliphatic resin DEG-1 with epoxy terminal groups, polyethylene polyamine (PEPA) and as filler contains titanium dioxide in following ratio of components, wt%: epoxy resin KDA 76–87, PEPA 7–13, titanium dioxide 0–15.
EFFECT: introduction of titanium dioxide in modified epoxy resin KDA provides improved strength characteristics of adhesive composition and gives required thixotropic properties.
1 cl, 1 tbl, 4 ex
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RU2266942C2 |
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RU2295509C1 |
Authors
Dates
2017-02-02—Published
2015-12-22—Filed