FIELD: chemistry.
SUBSTANCE: invention relates to laquer composition with high electric insulating properties and low moisture permeability, designed to protect printed circuit boards and radio electronic equipment (REE) components, and can be used in aircraft, missile and aerospace, mechanical engineering and other industries. The lacquer composition comprises a semi-finished laquer product and a hardener. The semi-finished lacquer contains fluorocopolymer - product of trifluoroethylene monomer copolymerization with alkyl vinyl and hydroxil vinyl ethers at a ratio of 22.4:8.8:8.8, a polyorganosiloxane modifier K-9, grade A, an organic solvent xylene. As a hardener, the lacquer composition comprises polyisocyanate biuret, at the following component ratio, wt %: 60-85 of fluorocopolymer, 4-14 of modifier, 5-25 of hardener, 5-30 of organic solvent. The lacquer composition is a cold-curing composition, the curing process takes place at a temperature of (20±2)°C for not more than 5 hours.
EFFECT: composition has specific volumetric electrical resistance increased by 5-10 percent, dielectric characteristics increased by 15-20 percent, and water absorption reduced more than 1,5 times, provides high adhesion and physical and mechanical properties, allows formation of a high-quality coating.
1 dwg, 2 tbl, 5 ex
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Authors
Dates
2017-03-22—Published
2015-09-24—Filed