HEADPHONE JACK, ELECTRONIC DEVICE, ELECTRONIC EQUIPMENT AND ELECTRONIC SYSTEM Russian patent published in 2017 - IPC H01R13/46 

FIELD: physics.

SUBSTANCE: headphone jack includes an insulating base and a metal contact terminal located in the insulating base, herewith the insulating base comprises an upper and a lower projection attached one over the other to the connecting part that forms a slot to insert the audio plug; so that the insertable groove is formed between the opposit surfaces of the upper and the lower projection outside of the insulating substrate, which is intended for mounting the printed circuit board by its inserting in the guide path formed by the insertable groove. The metal contact terminal is electrically connected to the audio plug inserted in the socket, and the respective conductive paths on the printed circuit board, which is inserted into the insertable groove.

EFFECT: providing the opportunities of independent connecting the headphone jack to the printed circuit board and improving the reliability of fixing the printed circuit board without any interaction with the external design.

9 cl, 4 dwg