FIELD: lighting.
SUBSTANCE: LED lighting device contains a printed circuit board (PCB) of a planar structure, an LED chip mounted on the PCB surface, a support connected to another PCB surface, and a radiator connected to the support and intended to dissipate the heat emitted by the LED chip. The support is made with a non-continuous through hole, passing through both surfaces of the support, and is connected to the radiator. The radiator comprises a heat pipe circuit formed as capillary tubes in which the working fluid is disposed and has a heat conducting portion to transfer heat from the support and a heat dissipating portion to dissipate heat. At that, the radiator heat pipe circuit is connected to the support when the radiator heat absorbing portion, inserted from the support surface into the said non-continuous through hole, comes into contact with the PCB.
EFFECT: simplified design and increased efficiency of heat sinking.
4 cl, 5 dwg
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