PLATE HEAT EXCHANGER Russian patent published in 2017 - IPC F28F19/02 

FIELD: heating system.

SUBSTANCE: plate heat exchanger comprises a wafer pack (2) and a covering it case (1). The wafers (2a) are linked in the pack (2) in such a way that the first and at least one other medium flow interchangeably in-between the adjoined wafers. One medium is delivered to the wafer pack (2) or is drained through the leak channel toward wafer pack, while the other medium is delivered to the sufficient spaces in-between the wafers or is drained through the space between the case (1) and the wafer pack (2) on the outside perimeter. It is of the essence that the following materials combination is applied: the wafers (2a) of the pack (2) are made in a known way of a corrosion-resistant material, the body is made of a non-corrosion-resistant material that has an enamel covering on the inside tending to be affected by the medium.

EFFECT: heat interchange increase.

13 cl, 2 dwg