METHOD OF FLUX-FREE SOLDERING OF ALUMINIUM PRODUCTS Russian patent published in 2017 - IPC B23K1/08 B23K103/10 

FIELD: metallurgy.

SUBSTANCE: in the soldering zone, silumin-based solder is placed. Product with a solid non-evaporable getter are loaded in the furnace chamber. The heating is carried out under vacuum (1-5)⋅10^-3 Pa with periodic holdings at temperature 180-200°C and 520-550°C for 1-5 hours to equalize the temperature field in the product. The product is held at the soldering temperature for 1-5 h. Cooling of the product and the getter is carried out in vacuum with intermediate holding at the temperature of 480-500°C for 1-3 hours for the getter regeneration. Cooling to 100°C is conducted under vacuum, after which the product with a non-evaporable solid getter is cooled in air.

EFFECT: conducting the process in substantially non-oxidizing atmosphere to provide tight and strong soldered joints, in particular for high shear density.